Shenzhen Tunsing Plastic Products Co., Ltd.
Shenzhen Tunsing Plastic Products Co., Ltd.
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Shen Zhen Tunsing High Temperature Double Sided Thermal Conductive Adhesive Tape For dual interface bank cards
Product: DS-6CA
Conductive Hot Mlet Adhesive Tape Description:
The hot melt adhesive has good electrical conductivity and is packaged by a dual interface smart card. Excellent adhesion to PVC, ABS, PC, FR-4 and other materials.
This product is a large molecular weight structural hot melt tape. The superior cohesion ensures that there is no structural breakage in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base. Meets the requirements of IC7816 for chip package fastness.
Conductive Hot Mlet Adhesive Tape Application:
DS-6CA is suitable for thermal packaging of dual interface bank cards and social security cards.
Conductive Hot Mlet Adhesive Tape Composition:
Polyamide synthesis modification
Packaging & Delivery:
Carton size: 40cm*40cm*16.5cm
A carton of twenty rolls.
All of them are vacuum packed.
Shipped in 3-15 days after payment.
Conductive Hot Mlet Adhesive Tape Physical Characteristics:
| Color | Black | Release Line | Glassine release paper |
| Density ASTM D-792 | 1.±0.02 g/cm³ | Conventional Thickness | 55um |
| Melting Range DSC | 80-100℃ | Conventional Width | 29MM |
| Melt Index ASTM D-1238 | 20±10g/10min | Conventional Length | 200M |
| Finished Products | 55um*29MM*200M | ||
Smart Card Tape Recommended Bonding Conditions:
| Flat initial chip backing | Flat secondary packaging: |
| Mechanical mold temperature: 140 ℃ to 160 ℃ | Mechanical mold temperature: 170 ℃ to 200 ℃ |
| Adhesive time: 0.6s-1.2s | Sealing time: 1.4 s-2.4 S |
| Pressure: 0.25-0.4 mpa | Pressure: 0.25-0.4mpa |
Notice:
1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.
Test Equipment
In order to strengthen the management of quality , we purchase many kinds of test equipments.
for example : Melt Flow Index Machine Differential Scanning Calorimetry Peel Force Tester High Low Temperature Tester Chamber Bend Distortion Tester Thrust Tester
FAQ:
1 .How about hot melt adhesive film?
It is just a film, and the basic material is release paper. But the film is solid in room temperature, when reach its melt point,it is able to bond other materials, Different materials of hot melt adhesive film have different performances and different usages, we need understand your demands,then recommend you right products to you.
2.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM,we are professional heat transfer material manufacturer ,having more than 10years experience.able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us konw.
3.How do you transport the products?
If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way.Of course if you have other better idea about transport, we will accept it.
4. May I have your samples?
If you need some sample for reference,please let us know your fully address/ship
mode with courier,and we will arrange sample for your reference.
5. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)
6. How do I pay for my order?
We accept L/C ,T/T ,Western Union , PayPal.
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